Taken from Digitimes … TSMC and Samsung Electronics (Samsung Electronics) will be fully expanded to the advanced packaging field. In addition to cautiously and clearly unveiling the blueprint for advanced processes and advanced packaging, TSMC has also accelerated the deployment of advanced packaging. The Zhunan plant will start mass production in the second half of 2021, and the Nanke plant will be in 2022.
According to the semiconductor industry, TSMC’s 5nm mass production in the second quarter is scheduled for the end of 2020, 6nm will be available at the end of 2020, and a 5nm enhanced version of N5P will be launched in 2021. 4nm will be mass production in 2022, and 3nm mass production target The time is the second half of 2022, and the progress of the process is quite clear. Even 2nm has already revealed the latest developments.
In addition to the 2nm Bamboo Technology R&D center and production base, TSMC has already begun site preparation. The most important thing is that it has determined that the 2nm process technology will be transferred to GAA. It has now left pathfinding and entered the delivery R&D stage. It has obtained a new order agreement from Apple and also started. 1 nanometer planning.